Ceramic Copper-Clad Substrate (DBCAMB, the core of power modules)
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Product Details
As a core material for high‑voltage power modules, ceramic‑copper‑clad substrates are well suited to the current mainstream demands of 800V high‑voltage fast‑charging vehicles and silicon‑carbide‑based electronic control systems. Compared with conventional substrates, they offer superior dielectric strength and excellent resistance to thermal‑mechanical fatigue, minimizing delamination of the copper layer and substrate cracking under repeated vehicle start‑stop cycles and fluctuating temperature conditions. This significantly reduces the failure‑rework rate of inverters and is primarily used in power modules for electronic control systems and charging stations.
Our company offers a comprehensive product portfolio spanning alumina, aluminum nitride, and silicon nitride, compatible with both DBC and AMB processes, and provides differentiated supply solutions tailored to commercial and passenger vehicles. We also offer custom sizing and incoming material re‑inspection services, addressing customers’ needs for small‑batch prototyping and tight lead times in large‑volume production, thereby ensuring the long‑term operational stability of main‑drive electronic control systems.
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Hong Kong Changhong Group Co., Ltd.
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+86-137-3914-1777 Ge Hongye
+86 182 5130 3039 Wang Di（business）
No. 77-1, Qingnian Middle Road, Chongchuan District, Nantong City, Jiangsu Province
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